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TPT-HB05-Wire-Bonder
Clark D22Manual bonder can be configured for bonding of 38 µm aluminum wire or 25 µm gold wire. Wedge bonding and ball bonding available. Substrate heating available and recommended for gold wire bonding. Bond tools allow access into deep and/or high aspect ratio structures not accessible to MEI or K&S bonders. Bond parameters are set via LCD screen and can be stored in memory.
For rates information, please see the rates page.
Primary Contact
Steve Kriske
607/255-2367
sjk27@cornell.edu
Clark Hall, Room D-21
Steve Kriske
607/255-2367
sjk27@cornell.edu
Clark Hall, Room D-21
Secondary Contact
Jonathan Shu
607/255-9833
jbs24@cornell.edu
Clark Hall, Room 633