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MicroMech Wafering Saw
Bard Hall B55Precision wafering/dicing machine with 3″, 4″, and 6″ diamond wafering blades. Table has a power feed with a 5″x 10″ magnetic chuck. Cutting is done under a water coolant mixture.
For rates information, please see the rates page.
Primary Contact
Mark Pfeifer
(607) 255-4161
map322@cornell.edu
Bard Hall, Room B-57
Mark Pfeifer
(607) 255-4161
map322@cornell.edu
Bard Hall, Room B-57